TSMC, Samsung commit to ASML’s newest chipmaking tools as AI drives demand
· Technology · CNBC
TSMC and Samsung have committed to adopting ASML's High NA extreme ultraviolet lithography machines to meet rising demand for advanced AI chips. ASML's machines cost approximately $400 million each and use high numerical aperture optics to print smaller, more intricate circuit patterns on silicon wafers. Samsung plans to utilize the technology for DRAM memory manufacturing starting in 2028, while TSMC expects to integrate the tools into advanced chip production by 2030. The commitments provide ASML with greater visibility for future manufacturing capacity as the company looks to extend a 120% stock run over the past year. Samsung and TSMC join Intel, which began using the High NA technology for advanced manufacturing in July.
Why it matters
The adoption of ASML's multi-million-dollar lithography tools by the world's two largest chipmakers secures the production roadmap for next-generation semiconductors required for artificial intelligence applications.
Read the original report — CNBC
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